Coplanar Metvia

	C_METVIA Coplanar Inter Metal Via Parameters Notes Equivalent Circuit
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Coplanar Inter Metall Via

The C_METVIA module is introduced to connect two coplanar transmission lines with different metal levels. The dimensions and metal level of connected lines are defined in data items addressed by C_LTYP1 and C_LTYP2. L is the length of connection region.

Parameters

Parameter	Description
L	Length of Via Section
C_TYP1	ID of coplanar transmission line applied at ports 1
C_TYP2	ID of coplanar transmission line applied at ports 1
C_SUB	ID of coplanar substrate definition
C_GRID	ID of simulation control data
TEMP	ID of element temperature definition used for noise computation

Notes

The C_METVIA module is not able to calculate a step. As a result, lines addressed by C_LTYP1 and C_LTYP2 must have the same line width W and the same slot width S.
The minimum value for L depends on the overlap defined in the currently selected foundry. In case of DEFAULT foundry, L should be greater than or equal to via_ol (see C_LAYER).
If L is set to zero or negative value, the automated layout generation works incorrectly if an via_ol (see C_LAYER) is defined for the inter metal via. In this case the generated layout has to be edited manually.
For the simulation of C_METVIA, the metallisation thickness of the center line is set to the sum of metallisation thickness of applied lines.

Equivalent Circuit

For the modeling of the C_METVIA element, a distributive equivalent circuit is used and the model parameter are derived from quasi-static FD-calculations. The DC and RF losses (represented by R´) due to the skin effect are calculated using the surface current distribution on the conductors. The dielectric loss of the substrate material (represented by G´, see also C_SUB) is also taken into account.