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The coplanar elements within COPLAN for ADS are separated into two palettes: “Coplanar Elements” and “Coplanar Coupled Elements”. The complete list of elements available in these two palettes are shown in Figure 3-4.
The library of COPLAN for ADS consists of three types of elements: Coplanar Transmission Lines, Coplanar Discontinuities and Coplanar Lumped Elements.
In the Group of Transmission lines, there is a Coplanar Transmission Line (C_LIN) with arbitrary geometrical dimensions and substrate parameters. The effect of finite ground planes as well as back side metallization is considered. The conductor as well as dielectric losses are taken into account and the line attenuation is calculated for both DC and RF. The next element is the Coplanar Inter Metal Via (C_METVIA) which is used for connecting different metal levels. This element is calculated as a coplanar transmission line where the conductor thickness is the sum of the metallization thickness of two utilized metal levels. C_LINE and C_METVIA are available in the palette “Coplanar Elements”.
A set of coupled coplanar lines with 2 to 10 coupled center lines (C_2COUP ... C_10COUP) and finite ground planes are also implemented into COPLAN for ADS and can be used for the realization of couplers or filters. The matrices of distributed parameters are calculated using quasi-static FDM and the scattering parameters are calculated for the given length of the coupled lines. These elements are available in the palette “Coplanar Coupled Elements”.
The Group of discontinuities consists of all usual discontinuities which are needed for the design of modern (M)MICs. From one port Coplanar Opens (C_OPEN) and Shorts (C_SHORT) over two port elements like Coplanar Gaps (C_GAP), Coplanar Steps (C_STEP), Coplanar Tapers (C_TAPER) and Coplanar Air-bridge (C_AIR) to more complicated junctions like Coplanar Bend (C_BEND), Coplanar Tee-Junction (C_TEE) and Coplanar Cross-Junction (C_CROSS) are available. All junctions can have arbitrary arrangement and combination of feed lines and air-bridge types. These elements are available in the palette “Coplanar Elements”.
The group of lumped elements contains the most used elements. These are: Coplanar Interdigital Capacitor (C_IDC), Coplanar Rectangular Spiral Inductor (C_RIND), Coplanar Thin film Resistor (C_TFR and C_TFG) and Coplanar MIM-Capacitor (C_MIM and C_CAPLIN). These elements are also available in the palette “Coplanar Elements”.
Figures 3-5 and 3-6 show the access to the palettes “Coplanar Elements” and “Coplanar Coupled Elements”. A detailed description of all elements and their use is given in chapter 5 and chapter 6.
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