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LTCC

Low Temperature Co-Fired Ceramic

LTCC The LTCC prototype production line at IMST facilitates cost-effective, fast and accurate multilayer LTCC module manufacturing. A team of specialists serves customers regarding material and foundry selection and manufacturing steps, as well as testing and characterisation. Post-processing technology like SMT, wire bonding, dicing and inspection capabilities complete the prototype service. There is a strong background in microwave, RF and mobile communication applications and a long-term cooperation with LTCC material suppliers and foundry services.
Low Temperature Co-Fired Ceramic

Multilayer ceramic circuits for micro and millimetre wave technology

LTCC Services Graphic<br>
  • Circuit, module, antenna design and development
  • Manufacturing prototypes and production ramp-up
  • Consulting and feasibility studies
  • LTCC-training and seminars
  • RF and µ-wave characterisation of circuits and antennas
  • Partner in national, European and ESA R&D projects
  • Rapid prototyping
  • Integration of antenna and embedded passives (R, L, C)
  • Cavities, windows, and micro channels
  • Advanced thermal management technologies
  • Post processing: assembly of SMD components and bare dies, wire bonding, flip-chip bonding, dicing
LTCC - From start to finish Graphic<br>

Capitalise on the benefits of LTCC

Low Temperature Co-Fired Ceramic is a composite of ceramic, glass and organic solvents. The 'green' tape is sintered below 900°C, enabling the use of screen-printed gold and silver conductors with high conductivity. Screen printing, an established, low-cost technology is combined with punched and metal-filled through holes for a complete multilayer process. The stacked layers form a homogenous substrate through lamination in an isostatic press followed by sintering/co-firing in a process furnace. The final substrate is robust in the harshest environments and temperature extremes. Its coefficient of thermal expansion is very close to integrated circuits on Silicon or GaAs, which is an advantage for multichip modules (MCM-C).
Special packaging functions can easily be integrated into the module by using cavities and windows in the LTCC substrate. Embedded elements such as inner capacitors, inductors and resistors increase the high-density circuit capabilities of LTCC. Even the very demanding task of integrating antennas into transceiver modules can be accomplished with this unique technology.

Keramis Synthesizer

Design and Applications

IMST applies LTCC multilayer technology ranging from a few MHz up to over 100 GHz. Highly integrated SMD-microwave components such as filters are realised, as well as complex communication and radar systems. High-reliability applications encompass space, military and medical solutions.

LTCC - Interested?
LTCC - Interested? Then contact us! Get in touch

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