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Technological Data Definition (Default Foundry) C_TECH

Symbol :

Parameters :

die_h0 = Height of dielectric for air bridges (for simulation only)
die_er0 = Relative permittivity of dielectric layer for air bridges (for simulation only)
die_td0 = Dielectric loss factor of dielectric layer for bridges (for simulation only)
cap_os1 = Oversize of bottom metal-plate of MIM capacitors with dielectric layer
cap_l1 = Length of the connection region of MIM capacitors with dielectric layer 1
die_h1 = Height of dielectric layer 1 (for simulation only)
die_er1 = Relative permittivity of dielectric layer1 (for simulation only)
die_td1 = Dielectric loss factor of dielectric layer 1 (for simulation only)
cap_os2 = Oversize of bottom metal-plate of MIM capacitors with dielectric layer 2
cap_l2 = Length of the connection region of MIM capacitors with dielectric layer 2
die_h2 = Height of dielectric layer 2 (for simulation only)
die_er2 = Relative permittivity of dielectric layer 2 (for simulation only)
die_td2 = Dielectric loss factor of dielectric layer 2 (for simulation only)
res_l = Length of the connection region for resistors
res_rs = Sheet resistivity of resistive layer (ohm/square) (for simulation only)
t1 = Thickness of metal level 1 (cond) (for simulation only)
rho1 = Resistivity of metal level 1 (cond) (for simulation only)
t2 = Thickness of metal level 2 (cond2) (for simulation only)
rho2 = Resistivity of metal level 2 (cond2) (for simulation only)

Range of Usage :

die_hn 5DL* < die_hn < 0.2 DL* (for n=0,1,2)
die_ern ³ 1 (for n=0,1,2)
cap_osn ³ 0 (for n=1,2)
cap_ln ³ 0 (for n=1,2)
res_l ³ 0
tn 5DL* < tn < 0.2 DL* (for n=1,2)
 * ) see C_GRID for information on DL

Notes/Equations/References :

  1. In this data item, the process data of a so called DEFAULT foundry are stored. This is an arbitrary foundry and the parameter can be modified by user.
  2. In the DEFAULT foundry, there are three two metal layers, three dielectric layers, and a resistive layer.
  3. If only the DEFAULT foundry is available (standard packet of COPLAN for ADS), the only name for C_TECH allowed is "C_TECH_DEFAULT". Use of another name causes the simulator to abort!
  4. The parameters die_h0, die_er0 and die_td0 represent the definition of dielectric layer which is used in air bridges (C_AIRTYP) addressed by the parameter DIE_IDX. The use of these layer for C_MIM and C_CAPLIN is not allowed.
  5. The parameters die_hn, die_ern, die_tdn, cap_osn and cpa_ln (n=1,2) represent the definition of dielectric layers used in capacitors (C_CAPLIN and C_MIM) addressed by the parameter DIE_IDX. For example if DIE_IDX in C-MIM is set to 1, a dielectric layer of thickness die_h1 and dielectric constant of die_er1 and loss tangent of die_td1 is used for the capacitor. In this case, cap_os1 is the oversize of the bottom plate and cap_l1 is the length of connection region. These two dielectric layers can also be used for air-bridges; however in this case the parameter cap_osn and cap_ln (n=1,2) are ignored.

  6. The parameters res_l and res_rs represent the definition of resistive layers for resistor elements C_TFR and C_TFG addressed by the parameter RES_ IDX.

  7. The parameters t1, rho1 and t2, rho2 represent the definition of metal layers addressed by CEN_MET, GDN_MET or LEVEL (see C_LINTYP, C_NL_TYP, C_IDC, C_RIND).
  8. roh1 and roh2 are specific resistivity of metal layers 1 and 2 related to Gold. For perfect gold, this value is 1.
  9. The value for metallization thickness tn (n=1,2) and dielectric height die_hn (n=0,1,2,...) does not depend on the grid size. However, for these two parameters, the ratio tn/DL and die_hn /DL should be between 0.2 and 5.0. Otherwise, the accuracy of the simulation can not be guaranteed.



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